662 gold thickness for through hole results

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo

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SMTnet Express - November 6, 2014

SMT Express, Issue No. 5 - from SMTnet.com

Horizontal Convection Reflow Technology Defined

SMT Express, Issue No. 2 - from SMTnet.com

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

SMT Express, Issue No. 5 - from SMTnet.com

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SMT Express, Volume 4, Issue No. 2 - from SMTnet.com