995 ground pad solder void results

SMTnet Express - December 31, 2015

SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International

A Two-Layer Board Intellectual Property to Reduce Electromagnetic Radiation

A Two-Layer Board Intellectual Property to Reduce Electromagnetic Radiation A Two-Layer Board Intellectual Property to Reduce Electromagnetic Radiation Many papers proposed the analyses for the effects of signal trace passing over the split ground

Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs

SMT Express, Volume 2, Issue No. 4 - from SMTnet.com

Micro-Sectioning of PCBs for Failure Analysis

SMTnet Express - February 24, 2022

Tombstone Troubleshooting

SMTnet Express - January 21, 2021

SMT Express, Volume 4, Issue No. 11 - from SMTnet.com

SMTnet Express - October 2, 2014

SMTnet Express, October 2, 2014, Subscribers: 23352, Members: Companies: 14077, Users: 36923 Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials Jennifer Nguyen Ranilo Aranda, David Geiger, and Murad Kurwa; Flextronics