Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
Fundamentals of Solder Paste Technology Fundamentals of Solder Paste Technology Solder pastes are key materials in surface mount technology (SMT) for assembly of printed circuit boards (PCBs). Introduction of lead-free has placed new demands
DOE for Process Validation Involving Numerous Assembly Materials and Test Methods DOE for Process Validation Involving Numerous Assembly Materials and Test Methods Selecting products that have been qualified by industry standards for use
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Horizontal Convection Reflow Technology Defined Horizontal Convection Reflow Technology Defined Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct
SMTnet Express, November 19, 2014, Subscribers: 23530, Members: Companies: 14112, Users: 37185 Effects of Packaging Materials on the Lifetime of LED Modules Under High Temperature Test Lei Nie, Wenjing Xiang - Hubei University of Technology
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