SMTnet Express, January 23, 2014, Subscribers: 26486, Members: Companies: 13559, Users: 35667 Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu by Martin K. Anselm, Ph.D. and Brian Roggeman; Universal Instruments Corp
; Henkel Electronic Materials Mid-chip solder bal
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale