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Lead-Free Wave Soldering

upon copper dissolution and solder maintenance issues

Assembly Process Variables Voiding At A Thermal Interface

Interface Universal Instruments Corporation Muffada

Fragility of Pb-free Solder Joints

Fragility of Pb-free Solder Joints News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Fragility of Pb-free Solder Joints Universal Instruments Credit/Source: Peter Borgesen

Method of Modeling Differential Vias

Method of Modeling Differential Vias Method of Modeling Differential Vias Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high

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