Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
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Conductive adhesives increase microchip packaging density Conductive Adhesives Increase Microchip Packaging Density Interconnecting microelectromechanical systems directly to printed circuit boards can improve reliability and reduce costs
