type of interconnection within a printed
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page A New Light-Weight Electronic Packaging Technology Based On Spray-Formed Silicon-Aluminiumby David M. Jacobson
High Voltage Chip Resistors High Voltage Chip Resistors Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
