128 ideal mold results

SMT Express, Volume 4, Issue No. 6 - from SMTnet.com

Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies

Optimizing Thermal & Mechanical Performance in PCBs

SMTnet Express February 7 - 2013, Subscribers: 26168

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SMTnet Express - September 24, 2015

SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad

SMTnet Express - October 18, 2018

SMT Express, Volume 3, Issue No. 12 - from SMTnet.com

A High Performance and Cost Effective Molded Array Package Substrate

A High Performance and Cost Effective Molded Array Package Substrate A High Performance and Cost Effective Molded Array Package Substrate In this article we present both a relatively new and innovative family of packages that is suitable