1143 inspection of smt boards, are solder balls acceptable? results

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

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SMT Express, Volume 3, Issue No. 5 - from SMTnet.com

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A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

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SMT Express, Issue No. 3 - from SMTnet.com

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SMTnet Express - April 16, 2015

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SMTnet Express - April 5, 2018

SMTnet Express, April 5, 2018, Subscribers: 30,982, Companies: 10,916, Users: 24,587 High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced

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SMTnet Express - March 10, 2016

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Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling

SMTnet Express - January 14, 2016