SMT Express, Volume VI, Issue No. 3 - from SMTnet.com Visit ATExpo and see the latest products and technologies for the entire assembly process. EXHIBITION: September 28-30, 2004CONFERENCE: September 27-30, 2004Donald E. Stephiens
Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
,Texas Instruments Inc., Dallas, TX ABSTRACT Minor voiding in
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