SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid
Featured Article Return to Front Page REFLOW SOLDERING
solder-related defects on high-temperature therm
SMTnet Express, December 7, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland