SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
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Hyland; Agilent Au over Ni on Cu is a widely used p
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
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widely adopted Sn-3.0Ag-0.5Cu solder alloys for
SMTnet Express, January 23, 2014, Subscribers: 26486, Members: Companies: 13559, Users: 35667 Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu by Martin K. Anselm, Ph.D. and Brian Roggeman; Universal Instruments Corp
SMTnet Express, October 5, 2017, Subscribers: 30,900, Companies: 10,753, Users: 23,894 Intermetallic Compounds In Solar Cell Interconnections Including Lead-Free, Low Melting Point Solders Torsten Geipel, Achim Kraft, Ulrich Eitner - ISE , Monja