907 ipc 600 results

Screening for Counterfeit Electronic Components

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology

Low Cost Metrology First published in the 2012 IPC

Thermal Characteristics of PCB Laminates used in High Frequency Applications

published in the 2012 IPC APEX EXPO technical con

New Developments in PCB Laminates

New Developments in PCB Laminates Online Version SMTnet Express July 19, 2012, Subscribers: 25329, Members: Companies: 8927, Users: 33365 New Developments in PCB Laminates First published in the 2012 IPC APEX EXPO technical conference proceedings

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

An Investigation of Whisker Growth on Tin Coated Wire and Braid

IPC APEX EXPO technical conference proceedings.

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

in the 2012 IPC APEX EXPO technical conference procee