1028 ipc 610 d solder ball results

Strength of Lead-free BGA Spheres in High Speed Loading

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Dross and the Selective Soldering Process

Dross and the Selective Soldering Process Dross and the Selective Soldering Process In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction

SMTnet Express - December 3, 2020

SMTnet Express - January 17, 2019

SMTnet Express, January 17, 2019, Subscribers: 31,198, Members: Companies: 10,693, Users: 31,603 IPC APEX EXPO 2019 - TECHNOLOGY'S FUTURE COMES TOGETHER Why Attend IPC APEX EXPO 2019? Because IPC APEX EXPO

SMTnet Express - December 12, 2019

SMTnet Express, December 12, 2019, Subscribers: 33,007, Companies: 10,941, Users: 25,408 IPC APEX EXPO 2020 – Celebrating 20 Years of Excellence in Electronics This year marks the 20th anniversary of IPC APEX EXPO and IPC is thrilled

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

SMTnet Express - March 06, 2014

SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia

Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes