Featured Article Return to Front Page REFLOW SOLDERING
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging
SMTnet Express, May 14, 2020, Subscribers: 29,151, Companies: 11,003, Users: 25,794 Reliable Selective Soldering For High Volume Assemblies Credits: ITW EAE The number of through hole connections on a circuit assembly are decreasing with the drive
IPC is the trade association for the printed wiring board and electronics assembly industries.
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