899 ipc and 2221 results

Express Newsletter: ipc and 2221 (Page 10 of 90)

Thermal Characteristics of PCB Laminates used in High Frequency Applications

published in the 2012 IPC APEX EXPO technical con

New Developments in PCB Laminates

New Developments in PCB Laminates Online Version SMTnet Express July 19, 2012, Subscribers: 25329, Members: Companies: 8927, Users: 33365 New Developments in PCB Laminates First published in the 2012 IPC APEX EXPO technical conference proceedings

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

An Investigation of Whisker Growth on Tin Coated Wire and Braid

IPC APEX EXPO technical conference proceedings.

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

in the 2012 IPC APEX EXPO technical conference procee

SMTnet Express April 11 - 2013, Subscribers: 26336

SMTnet Express May 23 - 2013, Subscribers: 26128

SMTnet Express May 23, 2013, Subscribers: 26128, Members: Companies: 13386, Users: 34738 IPC Standards and Printed Electronics Monetization by: Daniel Gamota; Printovate Technologies Printed Electronics is considered by many international