250 ipc-2222 trace spacing results

HALT Testing of Backward Soldered BGAs on a Military Product

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SMTnet Express - December 10, 2015

SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP Myung-June Lee

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SMTnet Express - November 27, 2013

SMTnet Express, November 27, 2013, Subscribers: 26387, Members: Companies: 13501, Users: 35461 Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications by Olivier Vendier, Jean-Louis Cazaux, Jean-Luc Lortal; Thales

SMTnet Express - April 21, 2016

SMT Express, Volume 5, Issue No. 1 - from SMTnet.com

Mixer Gain Simulation in WinSPICE3

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

Lean, Mean Dual-Lane Machines

Optimizing the Clean-Tech Manufacturing Mix