Express Newsletter: ipc-4104 material (Page 2 of 70)

SMTnet Express - October 15, 2015

SMTnet Express, October 15, 2015, Subscribers: 23,684, Members: Companies: 14,684, Users: 39,145 Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Dave Sommervold, Chris Parker, Steve

SMTnet Express - February 28, 2019

SMTnet Express, February 28, 2019, Subscribers: 31,699, Companies: 10,717, Users: 25,786 Evaluation, Selection and Qualification of Replacement Reworkable Underfill Materials Credits: Northrop Grumman Corporation A study was performed

SMTnet Express - October 20, 2016

SMTnet Express, October 20, 2016, Subscribers: 26,525, Companies: 15,001, Users: 41,289 Analysis of Laminate Material Properties for Correlation to Pad Cratering Carlos Morillo, Yan Ning, Michael H. Azarian, Julie Silk, Michael Pecht.; CALCE Pad

SMTnet Express - February 2, 2017

SMTnet Express, February 2, 2017, Subscribers: 30,132, Companies: 15,113, Users: 41,841 What Type of PCB Substrate Material Is Right for Your PCB? Dora Yang; PCBCart Basic performance of PCB (Printed Circuit Board) depends on the performance

SMTnet Express - May 4, 2017

SMTnet Express, May 4, 2017, Subscribers: 30,444, Companies: 10,591, Users: 23,216 Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry Francois


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