SMTnet Express, June 2, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D
SMTnet Express, October 11, 2018, Subscribers: 31,392, Companies: 11,058, Users: 25,281 3D Printed Electronics for Printed Circuit Structures Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, Kenneth Church; nScrypt Inc. Printed electronics is a
Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual
