Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components With PCB complexity and density increasing and also
SMTnet Express, March 26, 2020, Subscribers: 35,188, Companies: 10,983, Users: 25,722 New High-Speed 3D Surface Imaging Technology in Electronics Manufacturing Applications Credits: FocalSpec, Inc. This paper introduces line confocal technology
SMTnet Express, August 11, 2016, Subscribers: 26,064, Members: Companies: 14,906, Users: 40,872 New Approaches to Develop a Scalable 3D IC Assembly Method Charles G. Woychik Ph.D. Sangil Lee, Ph.D., Scott McGrath, Eric Tosaya and Sitaram Arkalgud
SMTnet Express, August 15, 2016, Subscribers: 26,471, Members: Companies: 14,957, Users: 41,086 Long Term Thermal Reliability of Printed Circuit Board Materials Eva McDermott, Ph.D., Bob McGrath, and Christine Harrington; Amphenol Printed Circuit
SMTnet Express, June 2, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D
