1129 is it okay to used expired solder paste results

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Organic Flip Chip Packages for Use in Military and Aerospace Applications  Featured Article Organic Flip Chip Packages for Use in Military and Aerospace Applications Endicott Interconnect Technologies David Alcoe, Kim Blackwell and Irving Memis

SMT Express, Volume 2, Issue No. 7 - from SMTnet.com

Strength of Lead-free BGA Spheres in High Speed Loading

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

SMTnet Express - June 16, 2022

Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment

AOI-AXI Duo Improves Product Yield

SMT Express, Volume 3, Issue No. 3 - from SMTnet.com

SMT Express, Special Edition, Issue 1 - from SMTnet.com

SMT Express, Volume 4, Issue No. 2 - from SMTnet.com