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Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

SMTnet Express - October 23, 2014

High-Speed Stamp Soldering

High-Speed Stamp Soldering

Optimizing Thermal & Mechanical Performance in PCBs

Liquid Tin Corrosion and Lead Free Wave Soldering

Placement Optimisation in a Lean Manufacturing Environment

High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge)

Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity

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