testing to detect intra-IC interconnect assembly
SMTnet Express, August 11, 2016, Subscribers: 26,064, Members: Companies: 14,906, Users: 40,872 New Approaches to Develop a Scalable 3D IC Assembly Method Charles G. Woychik Ph.D. Sangil Lee, Ph.D., Scott McGrath, Eric Tosaya and Sitaram Arkalgud
SMTnet Express June 20, 2013, Subscribers: 26136, Members: Companies: 13402, Users: 34820 Implementation of Effective ESD Robust Designs by: Industry Council on ESD Target Levels While IC level ESD design and the necessary protection levels
