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Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Endicott Interconnect Technologies Credit/Source: Michael J. Rowlands, Rabindra Das More and more

SMTnet Express - June 17, 2021

Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies

SMTnet Express - May 4, 2017

Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Nepcon East 2006 Express

Drop Shock Reliability of Lead-Free Alloys – Effect of Micro-Additives

SMTnet Express - October 23, 2014

Design Environment ROI: How Design Teams On A Budget Can Build A Best In Class Design Environment