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Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

IPC Printed Circuits Expo APEX

SMTnet Express - October 6, 2016

SMTnet Express, October 6, 2016, Subscribers: 26,499, Companies: 14,980, Users: 41,213 Figure 1-An IoT PCB Using Rigid-Flex Construction PCB Laser Depanelizing Using a UV Laser Bob Wettermann; BEST Inc. One of the methods gaining in popularity

SMTnet Express - April 27, 2017

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SMT Express, Volume 2, Issue No. 10 - from SMTnet.com

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Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment

SMT Express, Volume 2, Issue No. 7 - from SMTnet.com

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New BGA Solder Mask Repair Technique Using Laser Cut Stencils If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ New BGA Solder Mask Repair Technique Using Laser Cut Stencils Best, Inc