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News  •  Forums  •  SMT Equipment  •  Company Directory  • Calendar   •  Career Center  •  Advertising  •  About FREE Company Listing!   Wave Testing Solder Joint Failures Using Dye

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

Developing a Reliable Lead-free SMT Assembly Process

Developing a Reliable Lead-free SMT Assembly Process Developing a Reliable Lead-free SMT Assembly Process What are the key process requirements to achieve reliable lead-free SMT assembly? Lead-free SMT can be achieved reliably if several

SMTnet Express - December 29, 2016

SMTnet Express, December 29, 2016, Subscribers: 30,326, Companies: 15,062, Users: 41,660 Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities Yanrong Shi, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.; Kester

APEX Trade Show Preview

Evaluating Soldering Irons for Lead Free Assembly

Evaluating Soldering Irons for Lead Free Assembly News  •  Forums  •  SMT Equipment  •  Company Directory  •  Calendar  •  Career Center  •  Advertising  •  About  •  FREE Company Listing!   Evaluating Soldering Irons for Lead Free Assembly

Optimizing Flip Chip Substrate Layout for Assembly

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Level Kester, Inc. Credit/Source: Peter Biocca, C

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

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SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

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