SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
Discover New Technologies, Processes, Equipment and Solutions at IPC APEX EXPO 2012 Discover New Technologies, Processes, Equipment and Solutions Printed Electronics, Defect Clinic and William Shatner Highlight IPC APEX EXPO 2012 The world
Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual