565 laser profile objective profile shapes (straight ramp, ramp-soak-spike classic, shoulder) results

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

APEX Trade Show Preview

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Assembly Technology Expo September 25-28, 2006 Rosemont, IL, USA

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose

SMT Express, Volume 3, Issue No. 5 - from SMTnet.com

SMT Express, Volume 3, Issue No. 11 - from SMTnet.com

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SMT Express, Volume 3, Issue No. 12 - from SMTnet.com

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SMT Express, Volume 4, Issue No. 2 - from SMTnet.com

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Characteristics of Conformal Coating