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Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

IPC Printed Circuits Expo APEX

IPC Printed Circuits Expo APEX

HASL - WHAT A HASSLE, or HASL'd AGAIN.

IPC Printed Circuits Expo APEX

IPC Printed Circuits Expo APEX

SMTnet Express March 14 - 2013, Subscribers: 26245

-off-the-shelf ball/column grid array packaging (COT

"Green" Nanocomposites for Electronic Packaging

"Green" Nanocomposites for Electronic Packaging News   Forums   SMT Equipment   Company Directory Calendar   Career Center   Advertising   About   FREE Company Listing! "Green" Nanocomposites for Electronic Packaging This paper examines the use

Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications

De-fluxing Eases "Sticky Situations"