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SMTnet Express, January 26, 2017, Subscribers: 30,126, Members: Companies: 15,096, Users: 41,799 TURN TOWARD THE FUTURE Turn Your Attention to IPC APEX EXPO 2017 Experience Technology's Turning Point Through IPC APEX EXPO 2017 Free
SMTnet Express, October 17, 2013, Subscribers: 26325, Members: Companies: 13458, Users: 35281 Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging by L.C. Tsao; National Pingtung University of Science
SMTnet Express, October 24, 2013, Subscribers: 26339, Members: Companies: 13466, Users: 35314 Effect of Reflow Profile on Intermetallic Compound Formation by I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza; Universiti Teknologi
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
