The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards Universal Instruments Credit/Source: Jay B. Hinerman, K. Srihari, Ph
Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
