Leaded and Lead-Free Solder Paste Evaluation Screening Procedure Leaded and Lead-Free Solder Paste Evaluation Screening Procedure Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder
Processing and Troubleshooting SMT, BGA, CSP and Flip Chip
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual
SMTnet Express, January 30, 2014, Subscribers: 26500, Members: Companies: 13561, Users: 35693 Going Lead Free With Vapor Phase Soldering - Lead Free Is Still a Challenge For Major Industries. by Andreas Thumm; IBL-Löttechnik GmbH As of today
Reworking QFN's Newly Developed Cost Effective Approach Reworking QFN's Newly Developed Cost Effective Approach As with any rework process, the pasting of the component is a sequential process. Each step is designed to minimize the risk of a
Aiming for High First-pass Yields in a Lead-free Environment Aiming for High First-pass Yields in a Lead-free Environment While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free
Lead-Free Solder Wafer Bumping Lead-Free Solder Wafer Bumping Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments
