349 level shelf results

SMT Express, Volume 4, Issue No. 2 - from SMTnet.com

SMTnet Express March 14 - 2013, Subscribers: 26245

SMTnet Express March 14, 2013, Subscribers: 26245, Members: Companies: 13310, Users: 34436 Assembly and Reliability of 1704 I/O FCBGA and FPBGAs by: Reza Ghaffarian, Ph.D.; Jet Propulsion Laboratory, California Institute of Technology Commercial-off-the-shelf

SMT Express, Volume 4, Issue No. 2 - from SMTnet.com

Strength of Lead-free BGA Spheres in High Speed Loading

SMT Express, Issue No. 5 - from SMTnet.com

Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures

3D IC Development Needs Innovative Socket Solution

3D ICs With TSVs - Design Challenges And Requirements

Nanofluids, Nanogels and Nanopastes for Electronic Packaging

Development of Ultra-Multilayer Printed Circuit Board