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E Newsletter SMT Express

E Newsletter SMT Express The featured article for our Express Newsletter for the week of January 28, 2010, "The Universal PCB Design Grid System" was written by Tom Hausherr, EDA Library Product Manager, Valor Computerized Systems

THT in-line Inspection: Contradiction or greater Efficiency?

Cleanliness of Stencils and Cleaned Misprinted Circuit Boards

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Dispelling 10 Myths About Nitrogen Reflow

Voiding Control for QFN Assembly

The Surface Finish Effect on the Creep Corrosion in PCB

Developing a Reliable Lead-free SMT Assembly Process

Micro-Sectioning of PCBs for Failure Analysis

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level