295 lifted pads in rogers laminate results

SMT Express, Issue No. 4 - from SMTnet.com

Selective Solder Paste Deposition Reliability Test Results

Implementing Lead Free Soldering – European Consortium Research

Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN

SMTnet Express - December 31, 2015

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 11 - from SMTnet.com

SMT Express, Volume 5, Issue No. 4 - from SMTnet.com