.33 means a defect rate of 60 parts per million (PPM)
Assembling the Next Electronic Equipment Generations Assembling the Next Electronic Equipment Generations Product roadmaps can look like largely theoretical constructs, but assembly requirements five or ten years down the line have very practical
substrate designs require signals paths that can
3D ICs With TSVs - Design Challenges And Requirements 3D ICs With TSVs - Design Challenges And Requirements As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up to 3D ICs
