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The Effect of Coating and Potting on the Reliability of QFN Devices.

Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes

SMTnet Express - February 4, 2016

Stencil Design using Regression

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SMTnet Express - May 29, 2014

SMTnet Express, May 29, 2014, Subscribers: 22783, Members: Companies: 13874, Users: 36243 Microspring Characterization and Flip-Chip Assembly Reliability B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F

SMTnet Express - May 29, 2014

SMTnet Express, May 29, 2014, Subscribers: 22783, Members: Companies: 13874, Users: 36243 Microspring Characterization and Flip-Chip Assembly Reliability B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F

SMTnet Express - February 25, 2021

SMTnet Express, February 25, 2021, Subscribers: 27,591, Companies: 11,297, Users: 26,495 In the past month ... • 50 questions were posed on the SMTnet FORUM by engineers seeking help on their production lines • 247 engineers, from