01005 production goes industry wide 01005 production goes industry wide The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components miniature size made them difficult
A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement
Selective Soldering Process Selective Soldering Process Although many through-hole components are being replaced by their surface mount (SMT) counterparts, printed circuit boards (PCBs) are still being designed with both types of components
High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force
Dispelling 10 Myths About Nitrogen Reflow Dispelling 10 Myths About Nitrogen Reflow In my twenty years in the electronics manufacturing industry, I have heard a lot of claims made about the use of nitrogen in inerted soldering processes: many
