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Pad Cratering - The Invisible Threat to the Electronics Industry

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Industry Requirement for 2D and 3D Inspection Technology in a Single AOI Platform

Novel Probing Concepts for Mass-Production Tests: Design and Challenges

Thermal Characteristics of PCB Laminates used in High Frequency Applications

Reliability of BGA Solder Joints after Re-Balling Process

SMTnet Express March 28 - 2013, Subscribers: 26288

SMTnet Express April 11 - 2013, Subscribers: 26336

Bridging at Reflow, What is the Cause and Can it be Eliminated?

Design and Construction Affects on PWB Reliability

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