813 mda testing results

Defect Coverage for Non-Intrusive Board Tests

Defect Coverage for Non-Intrusive Board Tests Defect Coverage for Non-Intrusive Board Tests Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale

Flux Collection and Self-Clean Technique in Reflow Applications

Developing an effective, fast-curing, environmentally sound conformal coating

Screen and Stencil Printing Processes for Wafer Backside Coating

Pin in Paste Stencil Design for Notebook Mainboard

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

01005 Assembly, the AOI route to optimizing yield