SMTnet Express, February 7, 2019, Subscribers: 31,653, Companies: 10,704, Users: 25,698 High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project Credits: Oracle Corporation The High Density Packaging (HDP
A Review of Test Methods and Classifications for Halogen-Free Soldering Materials A Review of Test Methods and Classifications for Halogen-Free Soldering Materials Over the last few years, there has been an increase in the evaluation and use
SMTnet Express, March 30, 2017, Subscribers: 30,363, Companies: 10,588, Users: 23,069 Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework Bob Wettermann; BEST Inc. , MIT There are multiple methods, each with its
SMTnet Express, May 4, 2017, Subscribers: 30,444, Companies: 10,591, Users: 23,216 Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry Francois
SMTnet Express, June 29, 2017, Subscribers: 30,527, Companies: 10,624, Users: 23,443 Round Robin of High Frequency Test Methods by IPC-D24C Task Group Glenn Oliver, Jonathan Weldon - DuPont , Chudy Nwachukwu - Isola, John Coonrod - Rogers
A New Stenciling Method for Reworking SMT Components A New Stenciling Method for Reworking SMT Components When reworking more complex SMT components such as finer pitch SMT components, SMTconnectors and even area array devices, the most common
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