876 micro bga stencil suggestion results

SMT Express, Issue No. 3 - from SMTnet.com

specified board, micro-stencil, part, and solder paste to

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder

Developing an effective, fast-curing, environmentally sound conformal coating

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

A NEW PARADIGM FOR DESIGN THROUGH MANUFACTURE

Fragility of Pb-free Solder Joints

Quantitative Evaluation of New SMT Stencil Materials

Quantitative Evaluation of New SMT Stencil Materials Quantitative Evaluation of New SMT Stencil Materials High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues

How Clean Is Clean