3D IC Development Needs Innovative Socket Solution 3D IC Development Needs Innovative Socket Solution Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications
SMTnet Express, September 21, 2017, Subscribers: 30,827, Companies: 10,729, Users: 23,835 2.5D and 3D Semiconductor Package Technology: Evolution and Innovation Vern Solberg; Vern Solberg - Solberg Technical Consulting The electronics industry
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