for multilayer chip inductors. A basic requirement is to achi
Method of Modeling Differential Vias Method of Modeling Differential Vias Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high
Soldering And Handling Recommendations For Large Size MLC Capacitors Soldering And Handling Recommendations For Large Size MLC Capacitors Multilayer Ceramic Capacitors (MLCC) come in a broad range of sizes, geometries, and values, offering design
SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
