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SMTnet Express - July 17, 2014

SMTnet Express, July 17, 2014, Subscribers: 22938, Members: Companies: 13943, Users: 36480 Enhancing Thermal Performance in Embedded Computing for Ruggedized Military and Avionics Applications. Darren Campo, Jens Weyant, Bryan Muzyka; Advanced

Trace, Track and Control: High Production Output at Low Costs

SMTnet Express June 13 - 2013, Subscribers: 26140

SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging

Defect Coverage for Non-Intrusive Board Tests

Defect Coverage for Non-Intrusive Board Tests Defect Coverage for Non-Intrusive Board Tests Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies

Ceramic to Plastic Packaging

Horizontal Convection Reflow Technology Defined

An Effective Design of Experiment Strategy to Optimize SMT Processes

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Assembling the Next Electronic Equipment Generations

A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration, and Cloud Computing

A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration, and Cloud Computing A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration