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The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN

SMTnet Express August 29 - 2013, Subscribers: 26233

Nanofluids, Nanogels and Nanopastes for Electronic Packaging

Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

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