3D ICs With TSVs - Design Challenges And Requirements Heat Management in Printed Circuit Boards This report discusses the significance of heat management in the design of printed circuit boards (PCB).After an introduction into the basics of PCBs
Development of Ultra-Multilayer Printed Circuit Board Development of Ultra-Multilayer Printed Circuit Board This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets
SMTnet Express April 18, 2013, Subscribers: 26335, Members: Companies: 13359, Users: 34594 Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies by: Carlos Montemayor; Dow Corning
