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SMTnet Express, October 24, 2013, Subscribers: 26339, Members: Companies: 13466, Users: 35314 Effect of Reflow Profile on Intermetallic Compound Formation by I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza; Universiti Teknologi
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
