SMTnet Express, May 14, 2015, Subscribers: 22,738, Members: Companies: 14,345 , Users: 38,183 Reliability of Stacked Microvia Hardeep Heer, Ryan Wong; Firan Technology Group The Printed Circuit Board industry has seen a steady reduction in pitch
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
IPC APEX EXPO Surges In San Diego IPC APEX EXPO Surges In San Diego The electronic interconnect industry came together at IPC APEX EXPO® in San Diego, with the show reporting a 26 percent increase in attendance over 2011 with 4
in the electronics industry due to the continuing trend of mini
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