1004 open solder voids results

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is facing issues with hot spots, solder joint stress

Meeting Heat And CTE Challenges Of PCBs And ICs

is facing issues with hot spots, solder joint stress

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Method for Automated Nondestructive Analysis of Flip Chip Underfill

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SMT Express, Volume 3, Issue No. 3 - from SMTnet.com

SMTnet Express - February 18, 2016

SMTnet Express, February 18, 2016, Subscribers: 24,125, Companies: 14,990, Users: 39,958 Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys Mehran Maalekian, Karl Seelig, Timothy O'Neill; AIM Solder As lead-free alloys

SMTnet Express - February 18, 2016

SMTnet Express, February 18, 2016, Subscribers: 24,125, Companies: 14,990, Users: 39,958 Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys Mehran Maalekian, Karl Seelig, Timothy O'Neill; AIM Solder As lead-free alloys